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Heat dissipation sheet Product List and Ranking from 8 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 10, 2025～Oct 07, 2025
This ranking is based on the number of page views on our site.

Heat dissipation sheet Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 10, 2025～Oct 07, 2025
This ranking is based on the number of page views on our site.

  1. Ally Japan 横浜本社 Kanagawa//Electronic Components and Semiconductors
  2. 宝永ゴム Osaka//Resin/Plastic
  3. ショウワ Osaka//Manufacturing and processing contract
  4. 4 null/null
  5. 5 日本旭立科技 Osaka//Resin/Plastic
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Heat dissipation sheet Product ranking

Last Updated： Aggregation Period:Sep 10, 2025～Oct 07, 2025
This ranking is based on the number of page views on our site.

  1. ☆Free sample available☆ Flexible heat dissipation sheet <HXXX series> Ally Japan 横浜本社
  2. Heat dissipation sheet 宝永ゴム
  3. Heat dissipation sheet, heat dissipation rubber (TIM material) ショウワ
  4. 4 Heat dissipation sheet
  5. 5 【Examples of Heat Dissipation Sheet (TIM) Adoption】 Car audio, tablets, etc. ショウワ

Heat dissipation sheet Product List

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Sekisui Chemical Co., Ltd. APCS Exhibition Information

Sekisui Chemical Co., Ltd. APCS Exhibition Information

Exhibiting at APCS (Advanced Packaging and Chiplet Summit)!

Sekisui Chemical Co., Ltd. will exhibit at the APCS (Advanced Packaging and Chiplet Summit) held from December 14 to December 16. December 14 (Wednesday) - 16 (Friday) 10:00-17:00 at Tokyo Big Sight (East Halls 1, 2, 3) Sekisui Chemical Co., Ltd. exhibition area: East Hall 3 side (3850) Sekisui Chemical offers a wide range of functional resin products in various forms, including tapes, films, thermal interface materials, fine particles, encapsulants, and clean containers, which can be used in semiconductor backend processes and various substrates (PCB, FPC, package substrates). In response to the increasingly advanced needs of the semiconductor industry, such as fine wiring, high-density design, 3D integration, and thin film technology, we provide high-performance products based on technologies such as adhesive control, uniform particle synthesis, thin film coating, and precision multilayer extrusion. Exhibited products: - High-adhesion, easy-peel UV tape SELFA - High thermal conductivity heat dissipation sheet MANION series - Clean UN bottle series - Water-soluble polymer for surface protection We have prepared various products to meet the cutting-edge needs related to semiconductors. Please feel free to visit our booth.

  • Plastic utensils and containers

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【Heat Dissipation Sheet】 High thermal conductivity, noise reduction, silicone-free, etc.

【Heat Dissipation Sheet】 High thermal conductivity, noise reduction, silicone-free, etc.

We handle a wide range of thermal conductivity materials and heat dissipation sheets that can absorb electromagnetic waves, and we will propose suitable materials based on your desired specifications. *Samples are available upon request.

Our company purchases a wide variety of thermal conductive sheets from multiple manufacturers and processes suitable materials according to our customers' needs. If you are having trouble with shape processing, whether you are an end user or a material manufacturer, please feel free to contact us. 【Thermal Conductive Sheets We Handle】*Partial Excerpt ■ Thermal conductive sheets with thermal conductivity in the vertical direction (thickness direction) ■ Thermal conductive sheets with high thermal conductivity of "30 W/m·K" or more ■ Thermal conductive sheets that can counteract noise ■ Silicone-free thermal conductive sheets ★ If you would like a sample, please request it through the inquiry form. *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts

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Heat dissipation sheet COH series

Heat dissipation sheet COH series

Taika Sheet-type Thermal Conductive Gel λ (Lambda) Gel COH Series

It is a sheet-type heat dissipation material that is placed in the gaps between heating elements and cooling components such as heat sinks to eliminate air pockets.

  • Other polymer materials
  • Other electronic parts

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Repoly Super Low Oil Bleed Ultra Soft Heat Dissipation Sheet AS Series

Repoly Super Low Oil Bleed Ultra Soft Heat Dissipation Sheet AS Series

An ultra-soft heat dissipation sheet that has no oil bleed even in a highly compressed state. UL flame retardant and RoHS compliant. [Catalog available]

AS200/AS400 is a gap-filling material with a high thermal conductivity of 2.0/40W/m*K. Due to its high flexibility, high compressibility, and resistance to oil bleed, the amount of oil bleed is extremely low even under high compression conditions. 【Features】 ◆ Oil contamination and appearance dirt caused by oil bleed and the adhesion of dust to electronic devices can be avoided. ◆ UL flame retardant and RoHS compliant. *For more details, please download the catalog or feel free to contact us.

  • Other polymer materials
  • plastic
  • Composite Materials

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Heat dissipation sheet

Heat dissipation sheet

Both silicone-based and elastomer-based materials can be handled! It is also possible to process by cutting out from sheets.

Baoyou Rubber handles "heat dissipation sheets." We can work with both silicone-based and elastomer-based materials. Additionally, we can mold from materials with excellent heat dissipation properties. Furthermore, we can also perform cutting processes from sheets. If you are having trouble with heat dissipation, please feel free to consult us. 【Features】 ■ Can be molded from materials with excellent heat dissipation properties ■ Cutting processes from sheets are also possible *For more details, please refer to the PDF document or feel free to contact us.

  • Rubber

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Heat Dissipation Sheet CW Series

Heat Dissipation Sheet CW Series

Heat dissipation sheet CW series

Heat dissipation sheet using Sarcon (Sarcon is a registered trademark of Fuji Polymer Industries Co., Ltd.)

  • transformer
  • Printed Circuit Board
  • Other electronic parts

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Thermal Interface Material (TIM)

Thermal Interface Material (TIM)

We have processing experience with boards for earth and sensors! The "softness" makes processing and handling difficult.

To soften TIM materials (thermal interface materials), it is necessary to reduce the resistance between different materials, while maintaining electrical insulation (with some components requiring conductivity) and achieving low thermal resistance. For example, there is a concept of directly bonding metal materials using silver or copper paste without TIM materials in between. However, when dealing with dissimilar materials, the surface roughness of each material creates gaps that can trap air, resulting in increased thermal resistance. To expel this air, TIM is inserted, and softness is required to easily fill these gaps, but this "softness" complicates processing and handling. [Main Processing Achievements] ■ Information Communication: Antennas, grounding, LCD conduction, noise countermeasures ■ Automotive: Sensor substrates *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Other polymer materials

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Heat dissipation sheet, heat dissipation rubber (TIM material)

Heat dissipation sheet, heat dissipation rubber (TIM material)

It is a material with high thermal conductivity in the vertical direction, suitable for electronic devices and automotive parts!

TIM materials (thermal interface materials, thermal conductive sheets, thermal conductive rubber) have high thermal conductivity in the vertical direction (thickness direction), filling gaps between different materials and serving the roles of thermal conduction and cushioning. For example, in thermal management using heat dissipation components like heat sinks, gaps occur due to the unevenness between the heat-generating element and the heat sink. By filling these gaps with thermal conductive sheets, smooth heat diffusion can be achieved. Showa is capable of processing such materials. Please inquire about sizes and shapes. 【Features】 ■ High thermal conductivity in the vertical direction (thickness direction) ■ Serves the roles of thermal conduction and cushioning ■ Often used in areas requiring conformability, but the softness increases processing difficulty ■ Capable of mass production *For more details, please refer to the PDF materials or feel free to contact us.

  • Rubber

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【Examples of Heat Dissipation Sheet (TIM) Adoption】 Car audio, tablets, etc.

【Examples of Heat Dissipation Sheet (TIM) Adoption】 Car audio, tablets, etc.

Achieves smooth heat transfer! Excellent thermal conductivity in the vertical direction, electrical insulation, and cushioning properties.

Generally, there are thermal management solutions using heat dissipation components such as heat sinks. However, both the heating element and the surface of the heat sink have fine irregularities, and when they are directly overlapped, gaps are created, which significantly hinder thermal conduction. By using a "thermal interface material (TIM)," smooth heat transfer can be achieved. It is made of a material that has high thermal conductivity in the vertical direction (thickness direction), filling the gaps between dissimilar materials and serving the roles of thermal conduction and cushioning. 【Examples of Use】 ■ Automotive: Car audio, car navigation systems ■ Aircraft: AV equipment such as seat monitors ■ Communication devices: Smartphones, tablets ■ Others: LED lighting, sensor boards, etc. *For more details, please refer to the PDF materials or feel free to contact us.

  • Other machine elements

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Heat dissipation sheet "PK Series"

Heat dissipation sheet "PK Series"

We can also accommodate forming through customization.

The "PK Series" is a gap-filling thermal interface material with a thermal conductivity of 2.0-7.0 W/m*K. It has a hardness of Shore OO/30-50, and possesses flexibility, compressibility, insulation properties, and self-adhesiveness, effectively filling design tolerances in mechanisms and demonstrating high stability. Additionally, our sheets can be customized for forming. Please feel free to consult us if you have any requests. 【Product Lineup】 ■PK223 ■PK404 ■PK504 ■PK605 ■PK700 *For more details, please download the PDF (English version) or feel free to contact us.

  • others

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Heat dissipation sheet "BS Series"

Heat dissipation sheet "BS Series"

We can provide customers with special needs for cutting-edge products.

The "BS Series" is a thermal conductive sheet that is very soft and elastic, with excellent resistance to deformation. It can prevent deformation of components such as PCBs due to assembly stress. With a thermal conductivity of 3.0-5.0 W/m*K, this gap-filling thermal material has a hardness of Shore OO/10-25, and features flexibility, compressibility, insulation, and self-adhesiveness, effectively filling design tolerances in mechanisms and demonstrating high stability. 【Series Lineup】 ■BS75K ■BS87-S ■BS89 ■S282-s *For more details, please download the PDF (English version) or feel free to contact us.

  • others

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☆Free sample available☆ Flexible heat dissipation sheet <HXXX series>

☆Free sample available☆ Flexible heat dissipation sheet <HXXX series>

This is a cooling heat sheet characterized by high thermal conductivity and flexible processing properties. Thermal sheets have seen increased demand in recent years, so please be sure to try our free sample.

★Product Features★ ーーーーーーーーーーーーーーーーーーーーーーーーー ● High flexibility and workability ● One-stop service including shape processing ● Low thermal resistance ● High compressibility ● Excellent thermal insulation ーーーーーーーーーーーーーーーーーーーーーーーーー ★Product Description We offer heat sheets as components for heat dissipation measures. They are widely used for heat dissipation in automotive applications, smartphones, optical devices, and more. This cooling sheet complies with RoHS 2.0, is halogen-free, flame-retardant UL, and meets REACH standards. It is also compatible with chemSHERPA. Not only available in sheet form, but we can also process and deliver them in your desired shape. By performing manufacturing and processing as a one-stop service, we enable high-quality quality control tailored to the material's characteristics, while achieving total cost reduction that includes processing. They are widely used for improving the heat dissipation efficiency of heat sinks and addressing heat issues in packaged components. Problems caused by heat often arise in relatively later stages of development, making these materials valuable for heat measures that minimize rework. They are commonly used in combination with air cooling fans and other devices.

  • Other electronic parts

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